| Sl.NO |
Description |
Capability |
| 1 |
Base Material |
FR3 & FR4 grade |
| 2 |
Layer Count |
Single & Double sided |
| 3 |
Minimum Hole Dia |
12 Mil (0.3mm) |
| 4 |
Board Thickness |
0.4mm To 2.4mm |
| 5 |
Minimum Trace width |
8 mils |
| 6 |
Minimum Clearance |
8 mils |
| 7 |
Silkscreen Line width |
8 mils – 10 mils |
| 8 |
Minimum Copper Clearance from the Board Edge |
20 mils |
| 9 |
Copper Thickness |
17.5 Microns to 70 Microns |
| 10 |
Surface Finishes |
HASL/SMOBC/ Immersion Tin |
| 11 |
Solder Mask Colors |
Green, Blue, White & Red |
| 12 |
Legend Marking |
White, Yellow, Black |
| 13 |
Testing |
BBT / FPT |
