Design Capabilities
- Library Management – Schematic part creation & Footprint creation (IPC stds)
- Designs accordance with industry standards IPC-2221, -2222, -2223 and IPC-SM-782.
- Board designs – Analog, Digital, High speed & Mixed signal based.
- Design of Complex Rigid, Metal core, Flex and Rigid flex boards
- Design of boards with 16+ layers
- Fine Pith BGA’s (0.4mm and 0.5mm Pitch) QFP’s, QFN’s and PGA packages
- Design of Multilayer cards with HDI, Blind, buried and Microvias.
- Design of boards with layer stack up Micro strip and Strip line for controlled impedance
- Design of boards to meet the DFM, DFA, DFT and RoHS compliance.
- Good Knowledge in Manufacturing and Assembly level processes.
- Hands on Experience on Latest EDA CAD tools
- Good Documentation and backups on completion of projects.
Library Management
- Creation of Schematic parts using OrCAD Capture CIS as per IPC / IEEE standards.
- Creation of Footprint creation as per IPC standards.
- Dedicated team for library part development
- Proven process and verification process in place
Schematics Capture
- Schematic captures from hand drawn using OrCAD Capture CIS
- Dedicated team for capture and verification
- Generation of Netlist and Bill of Materials
- Generation of required documents
Board Layout
- Design of Multilayer cards with HDI, Blind, buried and Microvias.
- Design of boards with 16+ layers
- Design of boards with layer stack up Micro strip and Strip line for controlled impedance
- Design of boards to meet the DFM, DFA, DFT and RoHS compliance
- Handover of Engineering Data to FAB & Assembly houses.
Tools
- OrCAD capture CIS Ver 10.5
- Cadence Allegro Ver 16.5
- GC preview – Gerber viewer
- Valor – Odb++ Viewer
